| Test Items |
Specifications |
Test Conditions / Test Methods |
Component Adhesion (push Test) |
Base: 0805 ≥ 2 Lbs Cover: 0805 ≥ 1 Lbs Base: 1206 ≥ 4 Lbs Cover: 1206 ≥ 2 Lbs |
The component should be soldered (232°C±5°C for 10 sec.) totinned copper substrate. Applied force gauge to the side of component It must withstand force of 2 or 4 pounds without failure of the component. |
| Drop Test |
Component should not be damaged |
Dropping chip by each side and corner. Drop 10 times in total Drop height:100cm Drop weight:125g |
| Solderability Test |
The terminal should at least be 90% covered with solder |
The component shall be dipped in a melted solder bath at 235°C±5°C for 5 seconds. |
Vibration Test (Low Frequency) |
Component should not be damaged |
1. Amplitude: 1.5 m/m 2. Frequency: 10-55-10 Hz(1min) 3. Direction: X, Y, Z 4. Duration: 2 Hrs/X, Y, Z |
| Test Items |
Specifications |
Test Conditions / Test Methods |
| Low Temperature Storage Test |
Impedance change: Within±20% Without distinct damage in ppearance. |
1. Temp: -40°C±C2°C 2. Time: 1000±48 Hours 3. Component should be tested after 1 hour at room temperature. |
| Thermal Shock Test |
Total: 5 Cycles |
| High Temperature Storage Test |
1. Temp: 85°C±2°C 2. Time: 1000±48 Hours 3. Component should be tested after 1 hour at room temperature. |
| Humidity Test |
1. Temp: 40°C±2°C 2. R.H.: 90%~95% 3. Time: 48±2 Hours |
| High Temperature Load Life Test |
There should be no evidence of short or open circuit |
1. Temp: 85°C±2°C 2. Time: 96±12 Hours 3. Load: Allowed DC Current |
| Low Temperature Load Life Test |
1. Temp: -40°C±2°C 2. Time: 96±12 Hours 3. Load: Allowed DC Current |