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| Reel Specifications & Packaging Quantity (Unit: mm) |
| Codes | ΦA | ΦB | ΦC | W | T | Paper Tape (PCS) |
| TCAL02 | 178 ± 1 | 60.2 ± 0.50 | 13.0 ± 0.50 | 13.2 ± 1.50 | 16.0 ± 0.20 | 10,000 |
| TCAL03 | 178 ± 1 | 60.0 + 0.50 | 13.0 ± 0.20 | 9.00 ± 0.50 | 12.0 ± 0.15 | 5,000 |
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| Paper Tape Specifications (Unit: mm) |
| Codes | A | B | W ±0.10 |
E ±0.05 |
F ±0.05 |
P0 ±0.10 |
P1 | P2 ±0.05 |
ΦD0 | T |
| TCAL02 | 0.67±0.03 | 1.15±0.03 | 8.00 | 1.75 | 3.5 | 4.00 | 2.00±0.05 | 2.00 | 1.54±0.03 | 0.40±0.03 |
| TCAL03 | 1.10±0.05 | 1.90±0.05 | 8.00 | 1.75 | 3.5 | 4.00 | 4.00±0.10 | 2.00 | 1.55±0.05 | 0.60±0.03 |
| Environmental Characteristics |
| Item | Specification | Test Method |
| Bending Test | As SPEC. | JIS-C-5202-6.1.4 Bending Amplitude 3mm for 10 seconds |
| Dielectric Withstand Voltage | >100V | MIL-STD-202F Method 301 Apply 100VA (rms) for 1minute. |
| Insulation Resistance | >1000MM | MIL-STD-202F Method 302 Apply 100VDC for 1minute. |
| Resistance to Soldering Heat | ΔL≤10% | MIL-STD-202F Method 210E 260±5°C, 10±1seconds |
| High Temperature Exposure | ΔL≤10% | JIS-C-5202-7.2 85±2°C, 1000 +48/-0 hours |
| Moisture Resistance | ΔL≤10% | MIL-STD-202F Method 103B 40±2°C, 90~95%RH, 1000 +48/-0 hours |
| Low Temperature Storage | ΔL≤10% | JIS-C-5202-7.1 -40±3°C, 1000 +48/-0 hours |
| Temperature Cycle | ΔL≤10% | JIS-C-5202-7.4 -40/RT/85/RT, 10 cycles |
| Solderability | 95% min coverage | MIL-STD-202F Method 208H 235°C±5°C,2±0.5(sec) |
| Note: Storage Temperature: 25±3°C; Humidity: <80%RH |
| How to Order |
| TCAL | 02 | G | T | 10N | |||||||||
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