| 21 - 28 of about 28 for JIS. |
Metal Oxide Resistor
JIS C 5202 , MIL-R-22684B , Operating Temp.Range , -55°C~200°C , , , Temp.Coefficient (ppm C) , ± 300 , 5.2 , 4.6.11 , ...
Chip Resistors
JIS-C-5202-7.21000 hours @ +125°C without load , Resistance to Soldering Heat , ≤ ±0.02% , ≤ ±0.1% , MIL-STD-202F Method 210E260& ...
Choke Coils Passive Components
65293; Do not expose to direct sunlight (JIS C 805) , Dimensions with PVC or UL (unit: mm) , MODEL , A , B (max.) , C , D , LGC 0306 , 3.5±0.5 , 7 , 25 , 0.6 , LGC 0410 , 4.5±0.5 ...
Current Sense Resistor Passive Components
JIS-C-5202-5.5RCWV*2.5 or Max Overloading Voltage, 5 seconds , Resistance to Dry Heat , ±1%+0.5mΩ , ±1% , JIS-C-5202-7.296 hours @ + ...
SMD Inductors
TEST METHOD(JIS C 5321) , Resistance to Soldering Heat , No evidence of damage Δ L/L shall be within ±3% , Immerse in the solder (H63A)of 260±5& ... TEST METHOD(JIS C 5321) , LOW TEMP. Characteristics , No evidence of damage, Δ L/L within ±5%, Q/Q within ±30% , Immerse in the solder (H63A)of ...
SMD Wirewound Inductors
TEST METHOD(JIS C 5321) , Resistance to Soldering Heat , No evidence of damage Δ L/L shall be within ±3% , Immerse in the solder (H63A)of 260±5& ... TEST METHOD(JIS C 5321) , LOW TEMP. Characteristics , No evidence of damage, Δ L/L within ±5%, Q/Q within ±30% , Immerse in the solder (H63A)of ...
SMD Wirewound Inductors
TEST METHOD(JIS C 5321) , Resistance to Soldering Heat , No evidence of damage Δ L/L shall be within ±3% , Immerse in the solder (H63A)of 260±5& ... TEST METHOD(JIS C 5321) , LOW TEMP. Characteristics , No evidence of damage, Δ L/L within ±5%, Q/Q within ±30% , Immerse in the solder (H63A)of ...
精密貼片電阻/抗蝕薄膜排列電阻 - 中國德鍵
JIS-C-5202-7.2 , 1000 小時 @ +125°C 無負載 , 抗焊溫度 , ≤ ±0.02% , ≤ ±0.1% , MIL-STD-202F Method 210E , 260±° ...