| REQUIREMENTS |
CHARACTERISTICS |
TEST METHOD(JIS C 5321) |
LOW TEMP. Characteristics |
No evidence of damage, Δ L/L within ±5%,Q/Q within ±30% |
Immerse in the solder (H63A)of 260±5°C for 10±1sec, leave for 2hrs at normal TEMP. |
| TEMP. Cycling |
No evidence of damage, Δ L/L within ±5 |
Keep for 30 min. at TEMP.of -25°C~+85°C at 5 cycle case of TEMP. change from low to high and V.V. |
Temperature Characteristics |
Δ L/L within ±3% |
Δ L/L to be measured at the temperature of between -25°C and +85°C |
Moiisture load Characteristics |
No evidence of damage, Δ L/L within ±5%,Q/Q within ±30 |
TEMP.40±2°C,Humidity 90~95% 96± 2hrs, measurements shall be performed after 1~2hrs at normal TEMP.. |
High TEMP. overload Characteristics |
No evidence of damage, Δ L/L within ±5%,Q/Q within ±30 |
Leave for 96±2hrs in a bath of TEMP.85±2°C, measurements shall be performed after 1~2hrs at normal TEMP. |